The MediaTek Dimensity 8100 specifications have been leaked by an insider known as Digital Chat Station. The tipster claims that the new chipset will be more powerful and energy-efficient than its predecessor, the Dimensity 1200.
The chipset will feature four Cortex-A78 performance cores clocked at 2.85Ghz along with four Cortex-A55 power-saving cores. The chip will be based on TSMC’s 5nm fabrication process.
The MediaTek Dimensity 8100 processor will be manufactured in a 5nm process. The chips will feature four Cortex-A78 cores clocked at 2.85GHz and four Cortex-A55 cores clocked at 2.0GHz. The CPU will also include an Arm Mali-G610 MC6 GPU. The processor will support LPDDR5 RAM and UFS 3.1 storage.
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MediaTek Dimensity 8100- Key Features
The MediaTek Dimensity 8100 specifications were leaked on Weibo by a user with the Weibo account Digital Chat Station. It is believed that the chip will debut in the company’s new Redmi smartphone next month.
The rumored device to launch the MediaTek Dimensity 8100 is expected to be the first device to feature the chip. The exact date and name of the handset is still a mystery, but if the tipster is right, the MediaTek Dimensity 8100 will debut in a Redmi smartphone next month. However, it could be a mid-range Redmi K50 series smartphone.
As expected, the MediaTek Dimensity 8100 SoC is likely to debut in a mid-range smartphone this year. The tipster mentions that the chip could debut in a new Redmi K50 next month. If it does, it may be a contender for Qualcomm’s Snapdragon 888.
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MediaTek Dimensity 8100- Connectivities
As for its price, the MediaTek Dimensity 8100 SoC is expected to make its debut in a mid-range smartphone in March. The chip supports a variety of memory types, including LPDDR5 RAM and UFS 3.1 flash memory. If the phone is released, the specs will be revealed.
The upcoming MediaTek Dimensity 8100 is expected to be used in mid-range smartphones. While the chip’s processors are generally more powerful than the Snapdragon 888, the MediaTek Dimensity 8100 could peak at 2.85GHz. Aside from that, the chip will also support UFS 3.1 and LPDDR4 memory. In general, it is expected to be the perfect choice for smartphones.
The new SoC will be more energy-efficient and powerful than the Dimensity 1200. The new chip will have four Arm Cortex-A78 cores with a single GPU with two GHz and a Mali-G510 GPU. The new chipset is expected to debut in the new Redmi smartphone sometime in March 2022. There is no official confirmation of the launch of the MediaTek Dimensity 8100 SoC.
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MediaTek Dimensity 8100- Wrapping Up
The MediaTek Dimensity 8100 is a processor whose spec sheet reportedly is equivalent to the Snapdragon 888. It will use a Cortex-A55 GPU and a TSMC 5nm process. As a result, the chip will support a 2.6GHz clock speed. Furthermore, the MT8100 supports ARMv9 architecture and supports LPDDR3 memory.
The chip is said to offer a similar performance to the Snapdragon 888. According to the tipster, the chipset’s spec sheet also confirms that the Dimensity 8000 will support an LDDR5 RAM, which is expected to be more efficient than the Snapdragon 888. In addition, the new processor will support UFS 3.1 and a graphics processing unit (GPU) that is based on a TSMC’s 5nm process.
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